| 印制电路 |
printed circuit |
| 印制线路 |
printed wiring |
| 印制板 |
printed board |
| 印制板电路 |
printed circuit board (PCB) |
| 印制线路板 |
printed wiring board(PWB) |
| 印制元件 |
printed component |
| 印制接点 |
printed contact |
| 印制板装配 |
printed board assembly |
| 板 |
board |
| 单面印制板 |
single-sided printed board(SSB) |
| 双面印制板 |
double-sided printed board(DSB) |
| 多层印制板 |
mulitlayer printed board(MLB) |
| 多层印制电路板 |
mulitlayer printed circuit board |
| 多层印制线路板 |
mulitlayer prited wiring board |
| 刚性印制板 |
rigid printed board |
| 刚性单面印制板 |
rigid single-sided printed borad |
| 刚性双面印制板 |
rigid double-sided printed borad |
| 刚性多层印制板 |
rigid multilayer printed board |
| 挠性多层印制板 |
flexible multilayer printed board |
| 挠性印制板 |
flexible printed board |
| 挠性单面印制板 |
flexible single-sided printed board |
| 挠性双面印制板 |
flexible double-sided printed board |
| 挠性印制电路 |
flexible printed circuit (FPC) |
| 挠性印制线路 |
flexible printed wiring |
| 刚性印制板 |
flex-rigid printed board, rigid-flex printed board |
| 刚性双面印制板 |
flex-rigid double-sided printed board, rigid-flex double-sided printed |
| 刚性多层印制板 |
flex-rigid multilayer printed board, rigid-flex multilayer printed board |
| 齐平印制板 |
flush printed board |
| 金属芯印制板 |
metal core printed board |
| 金属基印制板 |
metal base printed board |
多重布线印制板
|
mulit-wiring printed board |
| 陶瓷印制板 |
ceramic substrate printed board |
| 导电胶印制板 |
electroconductive paste printed board |
| 模塑电路板 |
molded circuit board |
| 模压印制板 |
stamped printed wiring board |
| 顺序层压多层印制板 |
sequentially-laminated mulitlayer |
| 散线印制板 |
discrete wiring board |
| 微线印制板 |
micro wire board |
| 积层印制板 |
buile-up printed board |
| 积层多层印制板 |
build-up mulitlayer printed board (BUM) |
| 积层挠印制板 |
build-up flexible printed board |
| 表面层合电路板 |
surface laminar circuit (SLC) |
| 埋入凸块连印制板 |
B2it printed board |
| 多层膜基板 |
multi-layered film substrate(MFS) |
| 层间全内导通多层印制板 |
ALIVH multilayer printed board |
| 载芯片板 |
chip on board (COB) |
| 埋电阻板 |
buried resistance board |
| 母板 |
mother board |
| 子板 |
daughter board |
| 背板 |
backplane |
| 裸板 |
bare board |
| 键盘板夹心板 |
copper-invar-copper board |
| 动态挠性板 |
dynamic flex board |
| 静态挠性板 |
static flex board |
| 可断拼板 |
break-away planel |
| 电缆 |
cable |
| 挠性扁平电缆 |
flexible flat cable (FFC) |
| 薄膜开关 |
membrane switch |
| 混合电路 |
hybrid circuit |
| 厚膜 |
thick film |
| 厚膜电路 |
thick film circuit |
| 薄膜 |
thin film |
| 薄膜混合电路 |
thin film hybrid circuit |
| 互连 |
interconnection |
| 导线 |
conductor trace line |
| 齐平导线 |
flush conductor |
| 传输线 |
transmission line |
| 跨交 |
crossover |
| 板边插头 |
edge-board contact |
| 增强板 |
stiffener |
| 基底 |
substrate |
| 基板面 |
real estate |
| 导线面 |
conductor side |
| 元件面 |
component side |
| 焊接面 |
solder side |
| 印制 |
printing |
| 网格 |
grid |
| 图形 |
pattern |
| 导电图形 |
conductive pattern |
| 非导电图形 |
non-conductive pattern |
| 基材 |
base material |
| 层压板 |
laminate |
| 覆金属箔基材 |
metal-clad bade material |
| 覆铜箔层压板 |
copper-clad laminate (CCL) |
| 单面覆铜箔层压板 |
single-sided copper-clad laminate |
| 双面覆铜箔层压板 |
double-sided copper-clad laminate |
| 复合层压板 |
composite laminate |
| 薄层压板 |
thin laminate |
| 金属芯覆铜箔层压板 |
metal core copper-clad laminate |
| 金属基覆铜层压板 |
metal base copper-clad laminate |
| 挠性覆铜箔绝缘薄膜 |
flexible copper-clad dielectric film |
| 基体材料 |
basis material |
| 预浸材料 |
prepreg |
| 粘结片 |
bonding sheet |
| 预浸粘结片 |
preimpregnated bonding sheer |
| 环氧玻璃基板 |
epoxy glass substrate |
| 加成法用层压板 |
laminate for additive process |
| 预制内层覆箔板 |
mass lamination panel |
| 内层芯板 |
core material |
| 催化板材 |
catalyzed board ,coated catalyzed laminate |
| 涂胶催化层压板 |
adhesive-coated catalyzed laminate |
| 涂胶无催层压板 |
adhesive-coated uncatalyzed laminate |
| 粘结层 |
bonding layer |
| 粘结膜 |
film adhesive |
| 涂胶粘剂绝缘薄膜 |
adhesive coated dielectric film |
| 无支撑胶粘剂膜 |
unsupported adhesive film |
| 覆盖层 |
cover layer (cover lay) |
| 增强板材 |
stiffener material |
| 铜箔面 |
copper-clad surface |
| 去铜箔面 |
foil removal surface |
| 层压板面 |
unclad laminate surface |
| 基膜面 |
base film surface |
| 胶粘剂面 |
adhesive faec |
| 原始光洁面 |
plate finish |
| 粗面 |
matt finish |
| 纵向 |
length wise direction |
| 模向 |
cross wise direction |
| 剪切板 |
cut to size panel |
| 酚醛纸质覆铜箔板 |
phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) |
| 环氧纸质覆铜箔板 |
epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) |
| 环氧玻璃布基覆铜箔板 |
epoxide woven glass fabric copper-clad laminates |
| 环氧玻璃布纸复合覆铜箔板 |
epoxide cellulose paper core, glass cloth surfaces copper-clad laminates |
| 环氧玻璃布玻璃纤维复合覆铜箔板 |
epoxide non woven/woven glass reinforced copper-clad laminates |
| 聚酯玻璃布覆铜箔板 |
ployester woven glass fabric copper-clad laminates |
| 聚酰亚胺玻璃布覆铜箔板 |
polyimide woven glass fabric copper-clad laminates |
| 双马来酰亚胺三嗪环氧玻璃布覆铜箔板 |
bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates |
| 环氧合成纤维布覆铜箔板 |
epoxide synthetic fiber fabric copper-clad laminates |
| 聚四乙烯玻璃纤维覆铜箔板 |
teflon/fiber glass copper-clad laminates |
| 超薄型层压板 |
ultra thin laminate |
| 陶瓷基覆铜箔板 |
ceramics base copper-clad laminates |
紫外线阻挡型覆铜箔板
|
UV blocking copper-clad laminates |
A阶树脂
|
A-stage resin |
| B阶树脂 |
B-stage resin |
| C阶树脂 |
C-stage resin |
| 环氧树脂 |
epoxy resin |
| 酚醛树脂 |
phenolic resin |
| 聚酯树脂 |
polyester resin |
| 聚酰亚胺树脂 |
polyimide resin |
| 双马来酰亚胺三嗪树脂 |
bismaleimide-triazine resin |
| 丙烯酸树脂 |
acrylic resin |
| 三聚氰胺甲醛树脂 |
melamine formaldehyde resin |
| 多官能环氧树脂 |
polyfunctional epoxy resin |
| 溴化环氧树脂 |
brominated epoxy resin |
环氧酚醛
|
epoxy novolac |
| 氟树脂 |
fluroresin |
| 硅树脂 |
silicone resin |
| 硅烷 |
silane |
| 聚合物 |
polymer |
| 无定形聚合物 |
amorphous polymer |
| 结晶现象 |
crystalline polamer |
| 双晶现象 |
dimorphism |
| 共聚物 |
copolymer |
| 合成树脂 |
synthetic |
| 热固性树脂 |
thermosetting resin |
热塑性树脂
|
thermoplastic resin |
| 感光性树脂 |
photosensitive resin |
| 环氧当量 |
weight per epoxy equivalent (WPE) |
| 环氧值 |
epoxy value |
| 双氰胺 |
dicyandiamide |
| 粘结剂 |
binder |
| 胶粘剂 |
adesive |
| 固化剂 |
curing agent |
阻燃剂
|
flame retardant |
| 遮光剂 |
opaquer |
| 增塑剂 |
plasticizers |
| 不饱和聚酯 |
unsatuiated polyester |
| 聚酯薄膜 |
polyester |
| 聚酰亚胺薄膜 |
polyimide film (PI) |
聚四氟乙烯
|
polytetrafluoetylene (PTFE) |
聚全氟乙烯丙烯薄膜
|
perfluorinated ethylene-propylene copolymer film (FEP) |
| 增强材料 |
reinforcing material |
玻璃纤维
|
glass fiber |
| E玻璃纤维 |
E-glass fibre |
| D玻璃纤维 |
D-glass fibre |
S玻璃纤维
|
S-glass fibre |
玻璃布
|
glass fabric |
| 非织布 |
non-woven fabric |
| 玻璃纤维垫 |
glass mats |
| 纱线 |
yarn |
| 单丝 |
filament |
| 绞股 |
strand |
| 纬纱 |
weft yarn |
| 经纱 |
warp yarn |
| 但尼尔 |
denier |
| 经向 |
warp-wise |
| 纬向 |
weft-wise, filling-wise |
| 织物经纬密度 |
thread count |
织物组织
|
weave structure |
平纹组织
|
plain structure |
| 坏布 |
grey fabric |
| 稀松织物 |
woven scrim |
| 弓纬 |
bow of weave |
| 断经 |
end missing |
| 缺纬 |
mis-picks |
| 纬斜 |
bias |
| 折痕 |
crease |
| 云织 |
waviness |
| 鱼眼 |
fish eye |
| 毛圈长 |
feather length |
| 厚薄段 |
mark |
| 裂缝 |
split |
| 捻度 |
twist of yarn |
| 浸润剂含量 |
size content |
| 浸润剂残留量 |
size residue |
| 处理剂含量 |
finish level |
| 浸润剂 |
size |
| 偶联剂 |
couplint agent |
| 处理织物 |
finished fabric |
| 聚酰胺纤维 |
polyarmide fiber |
| 聚酯纤维非织布 |
non-woven polyester fabric |
| 浸渍绝缘纵纸 |
impregnating insulation paper |
| 81、 聚芳酰胺纤维纸：aromatic polyamide paper |
|
| 82、 断裂长：breaking length |
|
| 83、 吸水高度：height of capillary rise |
|
| 84、 湿强度保留率：wet strength retention |
|
| 85、 白度：whitenness |
|
| 86、 陶瓷：ceramics |
|
| 87、 导电箔：conductive foil |
|
| 88、 铜箔：copper foil |
|
| 89、 电解铜箔：electrodeposited copper foil (ED copper foil) |
|
| 90、 压延铜箔：rolled copper foil |
|
| 退火铜箔 |
annealed copper foil |
| 压延退火铜箔 |
rolled annealed copper foil (RA copper foil) |
| 薄铜箔 |
thin copper foil |
| 涂胶铜箔 |
adhesive coated foil |
| 涂胶脂铜箔 |
resin coated copper foil (RCC) |
复合金属箔
|
composite metallic material |
载体箔
|
carrier foil |
| 殷瓦 |
invar |
| 箔（剖面）轮廓 |
foil profile |
光面
|
shiny side |
| 粗糙面 |
matte side |
| 处理面 |
treated side |
| 防锈处理 |
stain proofing |
| 双面处理铜箔 |
double treated foil |
原理图
|
shematic diagram |
| 逻辑图 |
logic diagram |
| 印制线路布设 |
printed wire layout |
| 布设总图 |
master drawing |
| 可制造性设计 |
design-for-manufacturability |
| 计算机辅助设计 |
computer-aided design.(CAD) |
| 计算机辅助制造 |
computer-aided manufacturing.(CAM) |
| 计算机集成制造 |
computer integrat manufacturing.(CIM) |
| 计算机辅助工程 |
computer-aided engineering.(CAE) |
| 计算机辅助测试 |
computer-aided test.(CAT) |
| 电子设计自动化 |
electric design automation .(EDA) |
工程设计自动化
|
engineering design automaton .(EDA2) |
组装设计自动化
|
assembly aided architectural design. (AAAD) |
计算机辅助制图
|
computer aided drawing |
计算机控制显示
|
computer controlled display .(CCD) |
布局
|
placement |
布线
|
routing |
| 布图设计 |
layout |
重布
|
rerouting |
| 模拟 |
simulation |
| 逻辑模拟 |
logic simulation |
电路模拟
|
circit simulation |
| 时序模拟 |
timing simulation |
| 模块化 |
modularization |
| 布线完成率 |
layout effeciency |
| 机器描述格式 |
machine descriptionm format .(MDF) |
机器描述格式数据库
|
MDF databse |
| 设计数据库 |
design database
|
| 设计原点 |
design origin |
| 优化（设计） |
optimization (design) |
| 供设计优化坐标轴 |
predominant axis |
| 表格原点 |
table origin |
| 镜像 |
mirroring |
| 驱动文件 |
drive file |
| 中间文件 |
intermediate file |
| 制造文件 |
manufacturing documentation |
| 队列支撑数据库 |
queue support database |
| 元件安置 |
component positioning |
| 图形显示 |
graphics dispaly |
| 比例因子 |
scaling factor |
| 扫描填充 |
scan filling |
| 矩形填充 |
rectangle filling |
| 填充域 |
region filling |
| 实体设计 |
physical design |
| 逻辑设计 |
logic design |
| 逻辑电路 |
logic circuit |
| 层次设计 |
hierarchical design |
| 自顶向下设计 |
top-down design |
| 自底向上设计 |
bottom-up design |
| 线网 |
net |
| 数字化 |
digitzing |
| 设计规则检查 |
design rule checking |
| 走（布）线器 |
router (CAD) |
| 网络表 |
net list |
| 计算机辅助电路分析 |
computer-aided circuit analysis |
| 子线网 |
subnet |
| 目标函数 |
objective function |
| 设计后处理 |
post design processing (PDP) |
| 交互式制图设计 |
interactive drawing design |
| 费用矩阵 |
cost metrix |
工程图
|
engineering drawing |
方块框图
|
block diagram |
| 迷宫 |
moze |
| 元件密度 |
component density |
| 巡回售货员问题 |
traveling salesman problem |
| 自由度 |
degrees freedom |
| 入度 |
out going degree |
出度
|
incoming degree |
曼哈顿距离
|
manhatton distance |
| 欧几里德距离 |
euclidean distance |
| 网络 |
network |
| 阵列 |
array |
| 段 |
segment |
| 逻辑 |
logic |
| 逻辑设计自动化 |
logic design automation |
| 分线 |
separated time |
| 分层 |
separated layer |
| 定顺序 |
definite sequence |
| 导线（通道） |
conduction (track) |
导线（体）宽度
|
conductor width |
导线距离
|
conductor spacing |
导线层
|
conductor layer |
导线宽度/间距
|
conductor line/space |
第一导线层
|
conductor layer No.1 |
圆形盘
|
round pad |
方形盘
|
square pad |
菱形盘
|
diamond pad |
| 长方形焊盘 |
oblong pad |
子弹形盘
|
bullet pad |
泪滴盘
|
teardrop pad |
雪人盘
|
snowman pad |
| V形盘 |
V-shaped pad |
环形盘
|
annular pad |
| 非圆形盘 |
non-circular pad |
| 隔离盘 |
isolation pad |
| 非功能连接盘 |
monfunctional pad |
| 偏置连接盘 |
offset land |
| 腹（背）裸盘 |
back-bard land |
| 盘址 |
anchoring spaur |
| 连接盘图形 |
land pattern |
连接盘网格阵列
|
land grid array |
孔环
|
annular ring |
元件孔
|
component hole |
安装孔
|
mounting hole |
| 支撑孔 |
supported hole |
非支撑孔
|
unsupported hole |
| 导通孔 |
via |
镀通孔
|
plated through hole (PTH) |
| 31、 余隙孔：access hole |
|
| 32、 盲孔：blind via (hole) |
|
| 33、 埋孔：buried via hole |
|
34、 埋/盲孔：buried /blind via
|
|
| 35、 任意层内部导通孔：any layer inner via hole (ALIVH) |
|
| 36、 全部钻孔：all drilled hole |
|
| 37、 定位孔：toaling hole |
|
| 38、 无连接盘孔：landless hole |
|
| 39、 中间孔：interstitial hole |
|
| 40、 无连接盘导通孔：landless via hole |
|
| 引导孔 |
pilot hole |
端接全隙孔
|
terminal clearomee hole |
准表面间镀覆孔
|
quasi-interfacing plated-through hole |
准尺寸孔
|
dimensioned hole |
| 在连接盘中导通孔 |
via-in-pad |
| 孔位 |
hole location |
| 孔密度 |
hole density |
| 孔图 |
hole pattern |
钻孔图
|
drill drawing |
| 装配图 |
assembly drawing |
| 印制板组装图 |
printed board assembly drawing |
参考基准
|
datum referan |
915MHz天线，GPS天线，GSM天线，433MHz天线,13.56Hz天线，LTE天线
FPC座子0.5mm间距1.0mm间距1.25间距（带3D）
插件电解电容，贴片电容，钽电容，独石电容（带3D）
micro USB座子,Type C座子,USB-A公头（带3D）
三极管，MOS管，部分LDO（TO，SOT系列）（带3D）
芯片IC封装-QFP，TQFP，LQFP（带3D）
7段数码管0~9定时显示（文末获取代码及工程文件）
串口收发+按键控制数码管显示（文末获取代码及工程文件）
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【收藏】开关电源你必须知道的专业名字（中英对照）！！
【RT-Thread RISC-V 评估板】+ 上电，RGB流水灯走一个！
ART-Pi，基于RT-Thread Studio实现快速开发 ！
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